High-end memory manufacturer, G.Skill, will offer an all-new DDR5 specification in its Trident Z5 family for AMD Ryzen 7000 processors with EXPO support. Based on the information we have, it looks like the memory module maker will offer its lowest latency kit in the 6Gbps transfer rate range for Zen 4 chips.
G.Skill Readies AMD Ryzen 7000 “EXPO” Memory Rated at DDR5-6000, CL30, and 16GB by DIMM Flavors
G.Skill’s specific memory kit is “F5-6000J3038F16G” and judging from the name, it is a single-block memory module that operates at DDR5-6000 transfer rates and has rated timings at CL30-38-38-96. For comparison, the lowest latency kit you can get with XMP support for the Intel CPU platform is the “F5-6000J3040F16G” which is rated at the same DDR5-6000 speeds but slightly higher timings of CL-30-40-40-96. Both memory modules should be rated at 1.35-1.45V.
The G.Skill Trident Z5 DDR5 memory modules will include AMD’s EXPO (Extended Profiles For Ryzen Overclocking) support and will be compatible with AMD’s X670E, X670 and B650(E) series cards. It can also be confirmed that these modules will feature SK Hynix’s DDR5 DRAM ICs and also get the same Power Management IC (PMIC) controller as the rest of the DDR5 modules, as this is a JEDEC specification.
Just a few days ago, we reported that DDR5-6000 would be the sweet spot for AMD Ryzen 7000 processors based on the Zen 4 core architecture using EXPO technology. DDR5-6000 memory kits optimized with EXPO support will deliver the best performance with the lowest latency in a 1:1 FCLK (3 GHz). However, for those wanting higher bandwidth, there will be faster DDR5 DIMM offerings and we’ve seen speeds up to DDR5-6400 which we’ve been told is a push very entry-level from which overclocking speeds are really going to end.
In addition to DDR5 and EXPO support, we have also learned that AMD board partners will initially offer their motherboards with AGESA v220.127.116.11 Patch (DG) however, a more refined AGESA firmware known as v1.0.0. 2 will be available a few weeks later. Reviewers will primarily need to test their samples on version 18.104.22.168, so it would be wise to repeat testing once optimized BIOSes become available within months of launch.
It has been reported that overclockers will be pushing extreme LN2 overclocks with Zen 4 chips once they launch next month, so stay tuned for more information. AMD plans to do a full reveal of the processor lineup followed by the launch on September 15.